Manz AG developed a breakthrough production solution of panel-level packaging to seize the growth of automotive semiconductor

Panel Level Packaging production solutions drive scale production of newly architecture automotive ICs Dedicated Total Fab Solutions build high-efficiency production lines for FOPLP from pilot line to mass production solutionsBuild best-in-class Cu-plating uniformity and high current density to increase yields and throughput

TAOYUAN, Taiwan, May 23, 2023 /PRNewswire/ — Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in Penang, Malaysia. The participation of this exhibition reflecting the company’s focus on a total production solution of high-density packaging technologies that fulfill the high global demand for automotive chips. Highlighted within the Manz booth will be recent advancements in developing leading-edge Fan-Out Panel Level Packaging (FOPLP) solutions for ensuring higher efficiency and lower manufacturing cost.

Manz has built the industrial largest 700 x 700 mm process area FOPLP redistribution layer (RDL) production lines. Combined with this work, the company provides Total Fab planning from customized process development, equipment construction to the integration of upstream and downstream manufacturing production lines. The full range of service helps automotive chipmakers facing the critical technological challenges of fine-pitch copper line formation in redistribution layers of FOPLP process. These innovative solutions satisfy the demand for high production yields, excellent Cu-plating uniformity and high-density packages to deliver high performance power management ICs for electric vehicles. With our full strength to drive FOPLP production solutions forward, we assist customers to pursue breakthrough production methodology as well as ESG targets by increasing energy efficiency, and waste reduction.

Manz leveraging an open-architecture and modular design concept provides a comprehensive technology portfolio fulfilling the requirements of RDL process optimization and the flexibility to fit different stages of FOPLP production expansion. Seeing the huge growth of global automotive chip demand, Manz’s production solutions transform FOPLP as the prevailing technology in the advanced packaging market. 

FOPLP increases the performance of PMICs

Electric vehicle architectures are rapidly evolving to accommodate high power density devices, multiple power electronics and controller ICs. Manz RDL technology provides high density of fine pitch metal interconnects that redistribute the I/O access to integrate multiple dies into one single package. With the line width and spacing (L/S) specification of 5/5µm ranges, enable a significant reduction in thickness, weight, and manufacturing costs of the packaging while performing complex pattering and complicated layers design to satisfy high density packaging requirements.

Excellent uniformity, high thickness and fast speed of Cu-plating increase production yields plus assist customers for ESG targets

The newly developed electroplating process ensure electroplating panel surface uniformity at 92%, the Cu thickness could reach ≧100 μm which increase chip density, heat dissipation and a high current density of up to 5 ASD to ensure higher process speed to boost overall manufacturing capacity. With unique automatic gentle handling and jig-free vertical electroplating systems, which can save the material purchase cost, as well as reduce the consumption of electroplating chemicals and the cost of maintenance to help customers achieving ESG targets.

For more information please visit Manz website:



View original content to download multimedia:

SOURCE Manz Taiwan

Malaysia Healthcare Travel Council Denies Allegations of Lack Of Direction in the Company

KUALA LUMPUR, Malaysia, March 02, 2024 (GLOBE NEWSWIRE) — M

World Trade Organization Continues to Allow Subsidized Overfishing

WASHINGTON, March 01, 2024 (GLOBE NEWSWIRE) — This week, at



新發展 新空間 新動能——澳門各界歡迎橫琴正式封關運行

新華社澳門3月1日電 題:新發展 新空間 新動能——澳門各界歡迎橫琴正式封關運行

Veracio to Unveil their Next Generation of Orebody Technology Tools to Transform Mineral Exploration and Mining

SALT LAKE CITY, March 01, 2024 (GLOBE NEWSWIRE) —  Veracio,

Acronis Announces #TeamUp Partnership with Digacore and the New York Yankees

NEW YORK, March 01, 2024 (GLOBE NEWSWIRE) — Acronis, a glob





ATHA Energy Announces Approval to List on TSXV and Receipt of Final Order for Arrangement With Latitude Uranium

VANCOUVER, British Columbia, March 01, 2024 (GLOBE NEWSWIRE)








【特刊】龍年嬰兒潮:1988 年和 2012 年(2000年除外)



澳門政府將“輕軌東線之行車系統”判予三家實體合作經營,判給金額達澳門幣36.57億元(折合約4.6 億美元)。